SAE ARP6415

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Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

standard by SAE International, 07/23/2019

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SAE ARP6415 – Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.

Product Details

Published:
07/23/2019
File Size:
1 file , 1.8 MB
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